Printed Circuit Assembly

A Full Spectrum

Electronic manufacturing services utilizing the most advanced processes and technology

  • 01005 & uBGA capabilities
  • Flex Circuits and Mixed Technologies
  • X-Ray and Automated Optical Inspection
  • Flying Probe and Functional Testing




Custom and Hybrid Processes

  • Specializing in Complex Circuit Assemblies
  • Package on Package (POP)
  • Chip on Board (COB)
  • BGA underfill




Production Engineering

  • DFX Design Verification
  • Documented Process Routing
  • Serialized Tracking System Documenting Every Process Step for Every Product Produced
  • Component Engineering
  • Tooling Design





Circuit Repair

  • Complex Circuit Repairs
  • BGA Removal and Reballing


Electronic Manufacturing Services